::: Welcome to Intelligent Chip Connections Pte Ltd :::

:: Our Services ::

If you are looking for solutions to minimize your device dimensions or want to add more functions to your existing device size,
please call +65 6546 5756 or write to sales@connectingcircuits.com

News ::

April 2009: Intelligent Chip Connections awarded the Technology Innovation Grant by SPRING Singapore for development of its WLIM© technology

Sep 2010: Intelligent Chip Connections successfully demonstrates fully functional CMOS device wafers developed using its patented WLIM© architecture

Events ::

We exhibited our latest products and services at

Our Technologies

Glass Microfluidics Manufacturing Technology (MEE©)

MEE© is a breakthrough in glass microfabrication that allows you to produce microfeatures on glass using a scalable, reliable and mass producible process. Contact us today to know more on how our MEE© process can make glass as easily mass manufacturable as Silicon and as cost effective as polymers !

WLIM© is an entirely new approach to fabricate and package microelectronic and MEMS devices on pre-fabricated interconnect wafers. By using ICC WLIM© wafers and its back end processes, integrated device manufacturers can enjoy double benefits of both via-first and via-last integration methodologies. Contact us today to know more on how you can significantly save in manufacturing costs using our WLIM© architecture !

S-WLP© is a refreshing approach to adopt the via-middle integration methodology to package your devices at the wafer level. By fabricating low resistivity interconnect vias on the scribe zone, your active device area is undisturbed giving you unparalleled gains in yield and device performance. Contact us today to know more on how you can adopt S-WLP(C) to package your existing and new device wafers !

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