Intelligent Chip Connections Pte Ltd., has been established in year 2007 at the Republic of Singapore to provide packaging solutions to the growing needs of wafer fabrication houses and advance packaging houses. System Engineers / Device designers require very quick turnaround prototype packaging services for their first silicon produced at wafer foundries. This is required to push their new devices into the market as quickly as possible.

Like wise, miniature system engineers demand thin profile, smaller sized or chip sized packages with high performance and reliability. In other words, system engineers will be more than happy to see a device with minimum packaging time to demonstrate their design functionality, combined with a suitable package that can provide high functionality, yield, performance and lower cost.

ICC is setting-up a prototype packaging plant to meet the requirements of the wafer fabrication houses in and around Singapore in their initial phase, expected to be completed by September 2008. In parallel ICC experts are working on multiple solutions to minimize the packaging process time and improve the device performance such as speed, functionality, reliability and processing yields, optimization of the silicon real estate to obtain the maximum cost advantage. Currently engaged in development of New Generation Packaging programs including SIP, 3D, WLLM (Wafer Level Lens Module) and WLIM (Wafer Level Integration Module).

The Founders at ICC posses highest qualifications from prestigious institutes such as IIT (India), MIT / USC (USA), and bring in more than two decades of Semiconductor process, assembly & packaging experience combined with MEMS / Bio Medical - imaging technologies.