Wafer Level Packaging

- Drawing board to pilot run of a full fledged wafer bumping lines

- Fine pitch bumping with lead based / lead free solder paste / plating methods (includes copper chip)

- Wafer Redistribution, Passivation, Sputtered / plated UBM films, Bumping (fine pitch) solder alloys on silicon & other substrates

- Wafer Level Through Silicon Via format combined with mBGA format backside connections.

- Single die array format on a interposer substrate combined with mBGA format backside connections.

- Multiple die array format on a interposer substrate combined with mBGA format backside connection.

Die Level Packaging

We offer various prototyping services to the Semiconductor companies and packaging houses that require small volume packaging for their customer devices.

Following package types are available:

- Side Brazed package, any lead count
- Pin Grid Array
- Quad Flat pack
- Leaded / leadless Chip carrier
- Chip On Board
- Pre Molded Plastic leaded chip carriers
- Pre Molded Plastic leadless chip carriers
- MEMS packaging solutions

Ultra High Density Bumping Services

- High lead micro bumps

- 50um bump diameter and 150um inter-bump pitch

- Unique screen printing technology with zero error

- Available for wafer sizes of 150mm to 300mm

Silicon & Glass Interposers

- Embedded low resisitivity vias in wafer

- Via diameter as small as 3um and aspect ratio of 10

- Uniform via resistivity and dimensions across the wafer

- Other wafer characteristics as that of a IC grade wafer